2N7002L6327XT
Item specifics
- Automotive No
- Category Small Signal
- Channel Mode Enhancement
- Channel Type N
- Configuration Single
- ECCN (US) EAR99
- EU RoHS Compliant
- Lead Shape Gull-wing
- Maximum Continuous Drain Current (A) 0.3
- Maximum Diode Forward Voltage (V) 1.2
- Maximum Drain Source Voltage (V) 60
- Maximum Gate Source Leakage Current (nA) 10
- Maximum Gate Source Voltage (V) ±20
- Maximum Gate Threshold Voltage (V) 2.5
- Maximum Junction Ambient Thermal Resistance on PCB (°C/W) 250
- Maximum Operating Temperature (°C) 150
- Maximum Positive Gate Source Voltage (V) 20
- Maximum Power Dissipation (mW) 500
- Maximum Power Dissipation on PCB @ TC=25°C (W) 0.5
- Maximum Pulsed Drain Current @ TC=25°C (A) 1.2
- Minimum Gate Threshold Voltage (V) 1.5
- Minimum Operating Temperature (°C) -55
- Mounting Surface Mount
- Number of Elements per Chip 1
- Operating Junction Temperature (°C) -55 to 150
- Package Height 1(Max)
- Package Length 2.9
- Package Width 1.3
- Packaging Tape and Reel
- Part Status Obsolete
- PCB changed 3
- Pin Count 3
- PPAP No
- Process Technology OptiMOS
- Standard Package Name SOT
- Supplier Package SOT-23
- Typical Diode Forward Voltage (V) 0.96
- Typical Fall Time (ns) 3.1
- Typical Gate Charge @ 10V (nC) 0.4
- Typical Gate Charge @ Vgs (nC) 0.4@10V
- Typical Gate Plateau Voltage (V) 4
- Typical Gate Threshold Voltage (V) 2.1
- Typical Gate to Drain Charge (nC) 0.2
- Typical Gate to Source Charge (nC) 0.05
- Typical Input Capacitance @ Vds (pF) 13@25V
- Typical Output Capacitance (pF) 4.1
- Typical Reverse Recovery Charge (nC) 2.4
- Typical Reverse Recovery Time (ns) 8.5
- Typical Reverse Transfer Capacitance @ Vds (pF) 2@25V
- Typical Rise Time (ns) 3.3
- Typical Turn-Off Delay Time (ns) 5.5
- Typical Turn-On Delay Time (ns) 3
Product Description
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