AD5590BBCZ
Item specifics
- Architecture SAR
- Base Part Number AD5590
- Configuration MUX-S/H-ADC
- Contact Plating Copper, Silver, Tin
- Conversion Time-Max 0.8μs
- Converter Type ADC, SUCCESSIVE APPROXIMATION
- Data Interface Parallel
- ECCN Code EAR99
- Height 1.11mm
- Input Capacitance 20pF
- Input Type Single Ended
- Integral Nonlinearity (INL) 3 LSB
- Interface SPI
- JESD-609 Code e1
- Lead Free Contains Lead
- Length 10mm
- Lifecycle Status PRODUCTION (Last Updated: 3 weeks ago)
- Linearity Error-Max (EL) 0.0244%
- Max Input Voltage 5.25V
- Max Output Voltage 5V
- Max Power Dissipation 42.3mW
- Max Supply Voltage 5.25V
- Min Input Voltage 2.5V
- Min Output Voltage 2.5V
- Min Supply Voltage 2.7V
- Moisture Sensitivity Level (MSL) 3 (168 Hours)
- Mounting Type Surface Mount
- Nominal Supply Current 1.55mA
- Number of A/D Converters 1
- Number of Analog In Channels 16
- Number of Bits 12
- Number of Functions 1
- Number of Inputs 16
- Number of Pins 80
- Number of Terminations 80
- Operating Temperature -40°C~85°C
- Output Bit Code BINARY, 2'S COMPLEMENT BINARY
- Package / Case 80-LFBGA, CSPBGA
- Packaging Tray
- Part Status Active
- Pbfree Code no
- Peak Reflow Temperature (Cel) 260
- Pin Count 80
- Power Dissipation 25mW
- Qualification Status Not Qualified
- Ratio - S/H:ADC 1:1
- REACH SVHC No SVHC
- Reference Type External, Internal
- Resolution 1.5 B
- RoHS Status ROHS3 Compliant
- Sample and Hold / Track and Hold TRACK
- Sampling Rate 1 Msps
- Sampling Rate (Per Second) 1M
- Settling Time 6 μs
- Signal to Noise Ratio (SNR) 70 dB
- Slew Rate 1.5 V/μs
- Supply Voltage 5V
- Surface Mount YES
- Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Form BALL
- Terminal Pitch 0.8mm
- Terminal Position BOTTOM
- Time@Peak Reflow Temperature-Max (s) 30
- Voltage - Supply, Analog 2.7V~5.25V
- Voltage - Supply, Digital 2.7V~5.25V
- Width 10mm
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