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EP2AGX125DF25I5N
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Item specifics
- Base Part Number EP2AGX125
- Clock Frequency-Max 500 MHz
- ECCN Code 3A991
- HTS Code 8542.39.00.01
- Ihs Manufacturer INTEL CORP
- JESD-30 Code S-PBGA-B572
- JESD-609 Code e1
- Length 25 mm
- Manufacturer Intel Corporation
- Manufacturer Part Number EP2AGX125DF25I5N
- Moisture Sensitivity Level 3
- Mounting Type Surface Mount
- Number of I/O 260
- Number of Inputs 260
- Number of LABs/CLBs 4964
- Number of Logic Cells 118143
- Number of Logic Elements/Cells 118143
- Number of Outputs 260
- Number of Terminals 572
- Operating Temperature -40°C ~ 100°C (TJ)
- Operating Temperature-Max 100 °C
- Operating Temperature-Min -40 °C
- Package / Case 572-BGA, FCBGA
- Package Body Material PLASTIC/EPOXY
- Package Code HBGA
- Package Description 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
- Package Equivalence Code BGA572,24X24,40
- Package Shape SQUARE
- Package Style GRID ARRAY, HEAT SINK/SLUG
- Part Life Cycle Code Obsolete
- Part Status Active
- Peak Reflow Temperature (Cel) 260
- Power Supplies 0.9,1.2/3.3,1.5,2.5 V
- Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status Not Qualified
- Reach Compliance Code compliant
- Reflow Temperature-Max (s) 40
- Risk Rank 5.55
- Rohs Code Yes
- Seated Height-Max 2.2 mm
- Series Arria II GX
- Subcategory Field Programmable Gate Arrays
- Supplier Device Package 572-FBGA, FC (25x25)
- Supply Voltage-Max 0.93 V
- Supply Voltage-Min 0.87 V
- Supply Voltage-Nom 0.9 V
- Surface Mount YES
- Technology CMOS
- Temperature Grade INDUSTRIAL
- Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Form BALL
- Terminal Pitch 1 mm
- Terminal Position BOTTOM
- Total RAM Bits 8315904
- Voltage - Supply 0.87 V ~ 0.93 V
- Width 25 mm
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