A2F200M3F-FGG256I

Item specifics

• Architecture MCU, FPGA
• Base Product Number A2F200
• Brand Microchip Technology / Atmel
• Clock Frequency-Max 80 MHz
• Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Core Processor ARM® Cortex®-M3
• Data RAM Size 64 kB
• Device Logic Gates 200000
• Device System Gates 200000
• Factory Pack Quantity:Factory Pack Quantity 90
• Flash Size 256KB
• HTS Code 8542.39.00.01
• Ihs Manufacturer MICROSEMI CORP
• JESD-30 Code S-PBGA-B256
• JESD-609 Code e3
• Length 17 mm
• Manufacturer Microchip
• Manufacturer Part Number A2F200M3F-FGG256I
• Maximum Clock Frequency 80 MHz
• Maximum Operating Temperature + 100 C
• Mfr Microchip Technology
• Minimum Operating Temperature - 40 C
• Moisture Sensitive Yes
• Moisture Sensitivity Level 3
• Mounting Style SMD/SMT
• Number of CLBs 4608
• Number of Cores 1 Core
• Number of Equivalent Gates 200000
• Number of Gates 200000
• Number of I/O MCU - 25, FPGA - 66
• Number of I/Os 117 I/O
• Number of Inputs 66
• Number of Logic Cells 4608
• Number of Logic Elements 2000 LE
• Number of Outputs 66
• Number of Terminals 256
• Operating Supply Current 7 mA
• Operating Supply Voltage 1.5 V
• Operating Temperature -40 to 100 °C
• Operating Temperature-Max 100 °C
• Operating Temperature-Min -40 °C
• Organization 4608 CLBS, 200000 GATES
• Package Tray
• Package / Case FPBGA-256
• Package Body Material PLASTIC/EPOXY
• Package Code LBGA
• Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
• Package Equivalence Code BGA256,16X16,40
• Package Shape SQUARE
• Package Style GRID ARRAY, LOW PROFILE
• Packaging Tray
• Part Life Cycle Code Active
• Peak Reflow Temperature (Cel) 250
• Peripherals DMA, POR, WDT
• Power Supplies 1.5,1.8,2.5,3.3 V
• Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
• Product Category SoC FPGA
• Product Status Active
• Product Type SoC FPGA
• Program Memory Size 256 kB
• Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
• Qualification Status Not Qualified
• RAM Size 64KB
• Reach Compliance Code compliant
• Reflow Temperature-Max (s) 30
• Risk Rank 1.33
• RoHS Details
• Rohs Code Yes
• Seated Height-Max 1.7 mm
• Series A2F200
• Speed 80MHz
• Speed Grade STD
• Subcategory SOC - Systems on a Chip
• Supplier Device Package 256-FPBGA (17x17)
• Supply Voltage-Max 1.575 V
• Supply Voltage-Min 1.425 V
• Supply Voltage-Nom 1.5 V
• Surface Mount YES
• Technology CMOS
• Temperature Grade INDUSTRIAL
• Terminal Finish Matte Tin (Sn)
• Terminal Form BALL
• Terminal Pitch 1 mm
• Terminal Position BOTTOM
• Tradename SmartFusion
• Typical Operating Supply Voltage 1.5000 V
• Unit Weight 0.690329 oz
• Width 17 mm

Product Description