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M2S150TS-1FCG1152M
M2S150TS-1FCG1152M

M2S150TS-1FCG1152M

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Product Code: M2S150TS-1FCG1152M
Availability: In Stock
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Price: $19.90
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Item specifics

  • Architecture MCU, FPGA
  • Base Product Number M2S150
  • Brand Glenair
  • Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Core Processor ARM® Cortex®-M3
  • ECCN Code 3A001.A.2.C
  • Factory Pack Quantity:Factory Pack Quantity 1
  • Flash Size 512KB
  • HTS Code 8542.39.00.01
  • Ihs Manufacturer MICROSEMI CORP
  • JESD-30 Code S-PBGA-B1152
  • JESD-609 Code e1
  • Length 35 mm
  • Manufacturer Glenair
  • Manufacturer Part Number M2S150TS-1FCG1152M
  • Mfr Microchip Technology
  • Moisture Sensitivity Level 4
  • Number of I/O 574
  • Number of Inputs 574
  • Number of Logic Cells 146124
  • Number of Outputs 574
  • Number of Terminals 1152
  • Operating Temperature -55°C ~ 125°C (TJ)
  • Operating Temperature-Max 125 °C
  • Operating Temperature-Min -55 °C
  • Package Tray
  • Package / Case 1152-BBGA, FCBGA
  • Package Body Material PLASTIC/EPOXY
  • Package Code BGA
  • Package Description FBGA-1152
  • Package Equivalence Code BGA1152,34X34,40
  • Package Shape SQUARE
  • Package Style GRID ARRAY
  • Part Life Cycle Code Active
  • Peak Reflow Temperature (Cel) 250
  • Peripherals DDR, PCIe, SERDES
  • Power Supplies 1.2 V
  • Primary Attributes FPGA - 150K Logic Modules
  • Product Category D-Sub Mixed Contact Connectors
  • Product Status Active
  • Product Type Mixed Contact D-Sub Connectors
  • Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
  • Qualification Status Not Qualified
  • RAM Size 64KB
  • Reach Compliance Code compliant
  • Risk Rank 5.8
  • Rohs Code Yes
  • Seated Height-Max 2.9 mm
  • Series SmartFusion®2
  • Speed 166MHz
  • Subcategory D-Sub Connectors
  • Supplier Device Package 1152-FCBGA (35x35)
  • Supply Voltage-Max 1.26 V
  • Supply Voltage-Min 1.14 V
  • Supply Voltage-Nom 1.2 V
  • Surface Mount YES
  • Technology CMOS
  • Temperature Grade MILITARY
  • Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form BALL
  • Terminal Pitch 1 mm
  • Terminal Position BOTTOM
  • Time@Peak Reflow Temperature-Max (s) 40
  • Width 35 mm

Product Description

Microchip

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