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M2S050TS-FGG896I
M2S050TS-FGG896I

M2S050TS-FGG896I

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Product Code: M2S050TS-FGG896I
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Price: $4.24
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Item specifics

  • Architecture MCU, FPGA
  • Base Product Number M2S050
  • Composition Metal Film
  • Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Contact Plating Lead, Tin
  • Core Processor ARM® Cortex®-M3
  • Data RAM Size 64 kB
  • Diameter 3.68 mm
  • Features Flame Retardant Coating, Military, Moisture Resistant
  • Flash Size 256KB
  • HTS Code 8542.39.00.01
  • Ihs Manufacturer MICROSEMI CORP
  • JESD-30 Code S-PBGA-B896
  • JESD-609 Code e1
  • Lead Free Contains Lead
  • Length 8.7376 mm
  • Manufacturer Microsemi Corporation
  • Manufacturer Part Number M2S050TS-FGG896I
  • Max Operating Temperature 175 °C
  • Max Power Dissipation 250 mW
  • Maximum Clock Frequency 166 MHz
  • Mfr Microchip Technology
  • Military Standard MIL-R-10509
  • Min Operating Temperature -65 °C
  • Mount Through Hole
  • Mounting Style SMD/SMT
  • Number of Cores 1 Core
  • Number of I/O 377
  • Number of Inputs 377
  • Number of Logic Cells 56340
  • Number of Logic Elements 56340 LE
  • Number of Outputs 377
  • Number of Terminals 896
  • Number of Terminations 2
  • Operating Temperature -40°C ~ 100°C (TJ)
  • Package Tray
  • Package / Case 896-BGA
  • Package Body Material PLASTIC/EPOXY
  • Package Code BGA
  • Package Description FBGA-896
  • Package Equivalence Code BGA896,30X30,40
  • Package Shape SQUARE
  • Package Style GRID ARRAY
  • Packaging Tape & Reel (TR)
  • Part Life Cycle Code Active
  • Peak Reflow Temperature (Cel) 250
  • Peripherals DDR, PCIe, SERDES
  • Power Rating 250 mW
  • Power Supplies 1.2 V
  • Primary Attributes FPGA - 50K Logic Modules
  • Product Status Active
  • Program Memory Size 256 kB
  • Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
  • Qualification Status Not Qualified
  • RAM Size 64KB
  • Reach Compliance Code compliant
  • Reflow Temperature-Max (s) 40
  • Resistance 1.62 MΩ
  • Risk Rank 5.82
  • RoHS Compliant
  • Rohs Code Yes
  • Seated Height-Max 2.44 mm
  • Series SmartFusion®2
  • Speed 166MHz
  • Subcategory Field Programmable Gate Arrays
  • Supplier Device Package 896-FBGA (31x31)
  • Supply Voltage-Max 1.26 V
  • Supply Voltage-Min 1.14 V
  • Supply Voltage-Nom 1.2 V
  • Surface Mount YES
  • Technology CMOS
  • Temperature Coefficient 50 ppm/°C
  • Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form BALL
  • Terminal Pitch 1 mm
  • Terminal Position BOTTOM
  • Tolerance 1 %
  • Width 3.68 mm

Product Description

Microchip

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