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A2F500M3G-1CSG288I
A2F500M3G-1CSG288I

A2F500M3G-1CSG288I

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Product Code: A2F500M3G-1CSG288I
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Price: $14.51
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Item specifics

  • Architecture MCU, FPGA
  • Base Product Number A2F500
  • Clock Frequency-Max 100 MHz
  • Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
  • Core Processor ARM® Cortex®-M3
  • Flash Size 512KB
  • HTS Code 8542.39.00.01
  • Ihs Manufacturer MICROSEMI CORP
  • JESD-30 Code S-PBGA-B288
  • JESD-609 Code e1
  • Length 11 mm
  • Manufacturer Microsemi Corporation
  • Manufacturer Part Number A2F500M3G-1CSG288I
  • Mfr Microchip Technology
  • Moisture Sensitivity Level 3
  • Number of CLBs 11520
  • Number of Equivalent Gates 500000
  • Number of I/O MCU - 31, FPGA - 78
  • Number of Inputs 78
  • Number of Logic Cells 11520
  • Number of Outputs 78
  • Number of Terminals 288
  • Operating Temperature -40°C ~ 100°C (TJ)
  • Operating Temperature-Max 100 °C
  • Operating Temperature-Min -40 °C
  • Organization 11520 CLBS, 500000 GATES
  • Package Tray
  • Package Body Material PLASTIC/EPOXY
  • Package Code TFBGA
  • Package Description 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288
  • Package Equivalence Code BGA288,21X21,20
  • Package Shape SQUARE
  • Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
  • Part Life Cycle Code Active
  • Peak Reflow Temperature (Cel) 260
  • Peripherals DMA, POR, WDT
  • Power Supplies 1.5,1.8,2.5,3.3 V
  • Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Product Status Active
  • Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
  • Qualification Status Not Qualified
  • RAM Size 64KB
  • Reach Compliance Code compliant
  • Reflow Temperature-Max (s) 30
  • Risk Rank 5.24
  • Rohs Code Yes
  • Seated Height-Max 1.05 mm
  • Series SmartFusion®
  • Speed 100MHz
  • Speed Grade 1
  • Subcategory Field Programmable Gate Arrays
  • Supplier Device Package 288-CSP (11x11)
  • Supply Voltage-Max 1.575 V
  • Supply Voltage-Min 1.425 V
  • Supply Voltage-Nom 1.5 V
  • Surface Mount YES
  • Technology CMOS
  • Temperature Grade INDUSTRIAL
  • Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form BALL
  • Terminal Pitch 0.5 mm
  • Terminal Position BOTTOM
  • Width 11 mm

Product Description

Microchip

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