A2F500M3G-FGG484

Item specifics

• Architecture MCU, FPGA
• Base Product Number A2F500
• Brand Microchip Technology / Atmel
• Center Frequency 40 MHz
• Clock Frequency-Max 80 MHz
• Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Core Processor ARM® Cortex®-M3
• Data RAM Size 64 kB
• Device Logic Gates 500000
• Device System Gates 500000
• Factory Pack Quantity:Factory Pack Quantity 60
• Flash Size 512KB
• Frequency Aging ±2.8(20th) ppm/Year
• Frequency Stability 4.6 ppm
• HTS Code 8542.39.00.01
• Ihs Manufacturer MICROSEMI CORP
• JESD-30 Code S-PBGA-B484
• JESD-609 Code e1
• Length 23 mm
• Load Capacitance 10 pF
• Manufacturer Microchip
• Manufacturer Part Number A2F500M3G-FGG484
• Maximum Clock Frequency 80 MHz
• Maximum Operating Supply Voltage 1.575 V
• Maximum Operating Temperature + 85 C
• Mfr Microchip Technology
• Minimum Operating Supply Voltage 1.425 V
• Minimum Operating Temperature 0 C
• Moisture Sensitive Yes
• Moisture Sensitivity Level 3
• Mounting Surface Mount
• Mounting Style SMD/SMT
• Number of CLBs 11520
• Number of Cores 1 Core
• Number of Equivalent Gates 500000
• Number of Gates 500000
• Number of I/O MCU - 41, FPGA - 128
• Number of I/Os 204 I/O
• Number of Inputs 128
• Number of Logic Cells 11520
• Number of Logic Elements 6000 LE
• Number of Outputs 128
• Number of Terminals 484
• Operating Supply Current 16.5 mA
• Operating Supply Voltage 3.0000 V
• Operating Temperature -20 to 70 °C
• Operating Temperature-Max 85 °C
• Organization 11520 CLBS, 500000 GATES
• Output Frequency 40 MHz
• Output Level Clipped Sinewave
• Package Tray
• Package / Case FPBGA-484
• Package Body Material PLASTIC/EPOXY
• Package Code BGA
• Package Description 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
• Package Equivalence Code BGA484,26X26,40
• Package Shape SQUARE
• Package Style GRID ARRAY
• Packaging Tray
• Part Life Cycle Code Active
• Peak Reflow Temperature (Cel) 250
• Peripherals DMA, POR, WDT
• Pin Count 10
• Power Supplies 1.5,1.8,2.5,3.3 V
• Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
• Product Category SoC FPGA
• Product Status Active
• Product Type SoC FPGA
• Program Memory Size 512 kB
• Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
• Qualification Status Not Qualified
• RAM Size 64KB
• Reach Compliance Code compliant
• Reflow Temperature-Max (s) 40
• Risk Rank 1.37
• RoHS Details
• Rohs Code Yes
• Seated Height-Max 2.44 mm
• Series A2F500
• Shipping Restrictions This product may require additional documentation to export from the United States.
• Speed 80MHz
• Speed Grade STD
• Subcategory SOC - Systems on a Chip
• Supplier Device Package 484-FPBGA (23x23)
• Supply Voltage-Max 1.575 V
• Supply Voltage-Min 1.425 V
• Supply Voltage-Nom 1.5 V
• Surface Mount YES
• Technology CMOS
• Temperature Grade OTHER
• Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
• Terminal Form BALL
• Terminal Pitch 1 mm
• Terminal Position BOTTOM
• Tradename SmartFusion
• Type Temperature Compensated Crystal Oscillator (TCXO)
• Typical Operating Supply Voltage 1.5000 V
• Width 23 mm

Product Description