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M2S090-FCSG325I
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Item specifics
- Additional Feature LG-MIN, WD-MIN
- Architecture MCU, FPGA
- Base Product Number M2S090
- Board Material FR4 Epoxy Glass
- Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Contact Finish - Mating --
- Contact Finish - Post Tin-Lead
- Contact Finish Thickness - Mating --
- Contact Finish Thickness - Post --
- Contact Material - Mating --
- Contact Material - Post Brass
- Convert From (Adapter End) PLCC
- Convert To (Adapter End) DIP, 0.3 (7.62mm) Row Spacing
- Core Processor ARM® Cortex®-M3
- Current Rating 1A
- Data RAM Size 64 kB
- Features --
- Flash Size 512KB
- Housing Material --
- HTS Code 8542.39.00.01
- Ihs Manufacturer MICROSEMI CORP
- JESD-30 Code R-PBGA-B325
- JESD-609 Code e1
- Lead Free Status / RoHS Status --
- Length 13.5 mm
- Manufacturer Microsemi Corporation
- Manufacturer Part Number M2S090-FCSG325I
- Material Flammability Rating --
- Maximum Clock Frequency 166 MHz
- Mfr Microchip Technology
- Moisture Sensitivity Level 3
- Moisture Sensitivity Level (MSL) --
- Mounting Style SMD/SMT
- Mounting Type Through Hole
- Number of Cores 1 Core
- Number of I/O 180
- Number of Inputs 180
- Number of Logic Cells 86316
- Number of Logic Elements 86316 LE
- Number of Outputs 180
- Number of Pins 20
- Number of Terminals 325
- Operating Temperature --
- Package Tray
- Package / Case 325-TFBGA, FCBGA
- Package Body Material PLASTIC/EPOXY
- Package Code TFBGA
- Package Description FBGA-325
- Package Equivalence Code BGA325,21X21,20
- Package Shape RECTANGULAR
- Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
- Part Life Cycle Code Active
- Part Status Active
- Peak Reflow Temperature (Cel) 250
- Peripherals DDR, PCIe, SERDES
- Pitch - Mating 0.050 (1.27mm)
- Pitch - Post 0.100 (2.54mm)
- Power Supplies 1.2 V
- Primary Attributes FPGA - 90K Logic Modules
- Product Status Active
- Program Memory Size 512 kB
- Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status Not Qualified
- RAM Size 64KB
- Reach Compliance Code compliant
- Reflow Temperature-Max (s) 40
- Risk Rank 5.74
- Rohs Code Yes
- Seated Height-Max 1.16 mm
- Series Correct-A-Chip® 352000
- Speed 166MHz
- Subcategory Field Programmable Gate Arrays
- Supplier Device Package 325-FCBGA (11x13.5)
- Supply Voltage-Max 1.26 V
- Supply Voltage-Min 1.14 V
- Supply Voltage-Nom 1.2 V
- Surface Mount YES
- Technology CMOS
- Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Form BALL
- Terminal Pitch 0.5 mm
- Terminal Position BOTTOM
- Termination Solder
- Termination Post Length 0.125 (3.18mm)
- Width 11 mm
Product Description
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