M2S010T-VFG400I

M2S010T-VFG400I

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Product Code: M2S010T-VFG400I
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Item specifics

  • Architecture MCU, FPGA
  • Base Product Number M2S010
  • Breakdown Voltage 12.2 V
  • Clamping Voltage 18.2 V
  • Composition Zener
  • Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Core Processor ARM® Cortex®-M3
  • Data RAM Size 64 kB
  • Direction Bidirectional
  • Element Configuration Single
  • Flash Size 256KB
  • HTS Code 8542.39.00.01
  • Ihs Manufacturer MICROSEMI CORP
  • JESD-30 Code S-PBGA-B400
  • JESD-609 Code e1
  • Leakage Current 5 µA
  • Length 17 mm
  • Manufacturer Microsemi Corporation
  • Manufacturer Part Number M2S010T-VFG400I
  • Max Operating Temperature 150 °C
  • Max Reverse Leakage Current 5 µA
  • Max Surge Current 82.4 A
  • Maximum Clock Frequency 166 MHz
  • Mfr Microchip Technology
  • Min Breakdown Voltage 12.2 V
  • Min Operating Temperature -55 °C
  • Moisture Sensitivity Level 3
  • Mount Surface Mount
  • Mounting Style SMD/SMT
  • Number of Bidirectional Channels 1
  • Number of Cores 1 Core
  • Number of Elements 1
  • Number of I/O 195
  • Number of Inputs 195
  • Number of Logic Cells 12084
  • Number of Logic Elements 12084 LE
  • Number of Outputs 195
  • Number of Pins 2
  • Number of Terminals 400
  • Operating Supply Voltage 11 V
  • Operating Temperature -40°C ~ 100°C (TJ)
  • Package Tray
  • Package / Case 400-LFBGA
  • Package Body Material PLASTIC/EPOXY
  • Package Code LFBGA
  • Package Description VFBGA-400
  • Package Equivalence Code BGA400,20X20,32
  • Package Shape SQUARE
  • Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
  • Part Life Cycle Code Active
  • Peak Pulse Current 82.4 A
  • Peak Pulse Power 1.5 kW
  • Peak Reflow Temperature (Cel) 250
  • Peripherals DDR, PCIe, SERDES
  • Polarity Bidirectional
  • Power Line Protection No
  • Power Supplies 1.2 V
  • Primary Attributes FPGA - 10K Logic Modules
  • Product Status Active
  • Program Memory Size 256 kB
  • Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
  • Qualification Status Not Qualified
  • Radiation Hardening No
  • RAM Size 64KB
  • Reach Compliance Code compliant
  • Reflow Temperature-Max (s) 40
  • Reverse Breakdown Voltage 12.2 V
  • Reverse Standoff Voltage 11 V
  • Risk Rank 5.77
  • RoHS Compliant
  • Rohs Code Yes
  • Seated Height-Max 1.51 mm
  • Series SmartFusion®2
  • Speed 166MHz
  • Subcategory Field Programmable Gate Arrays
  • Supplier Device Package 400-VFBGA (17x17)
  • Supply Voltage-Max 1.26 V
  • Supply Voltage-Min 1.14 V
  • Supply Voltage-Nom 1.2 V
  • Surface Mount YES
  • Technology CMOS
  • Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Form BALL
  • Terminal Pitch 0.8 mm
  • Terminal Position BOTTOM
  • Test Current 1 mA
  • Width 17 mm

Product Description

Microchip

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