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XCVM1402-2MSENSVF1369
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Item specifics
- Architecture MPU, FPGA
- Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Height 8.382 mm
- Length 22.86 mm
- Manufacturer Lifecycle Status OBSOLETE (Last Updated: 2 years ago)
- Mfr AMD
- Number of I/O 424
- Operating Temperature 0°C ~ 100°C (TJ)
- Package Tray
- Package / Case 1369-BFBGA
- Peripherals DDR, DMA, PCIe
- Primary Attributes Versal™ Prime FPGA, 1.2M Logic Cells
- Product Status Active
- RoHS Compliant
- Series Versal™ Prime
- Speed 600MHz, 1.4GHz
- Supplier Device Package 1369-BGA (35x35)
- Weight 5.800001 g
- Width 21.082 mm
Product Description
AMD
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